Patents & Intellectual Property


Celadon Systems, Inc.’s business, products, and processes are protected by U.S. and International patents and pending U.S. and International patent applications. The issued patents include:


  • US      No. 6,201,402      13-Mar-2001

    PROBE TILE AND PLATFORM FOR LARGE AREA WAFER PROBING


  • JP      No. 3,287,800      15-Mar-2002

    PROBE TILE AND PLATFORM FOR DETAILED INSPECTION OF WAFER HAVING LARGE AREA


  • US      No. 6,586,954         1-Jul-2003

    PROBE TILE FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 7,786,743      31-Aug-2010

    PROBE TILE FOR PROBING SEMICONDUCTOR WAFER


  • TW      No. I318300      11-Dec-2009

    SHIELDED PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 7,768,282      3-Aug-2010

    APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER


  • US      No. 7,728,609      1-Jun-2010

    REPLACEABLE PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 7,659,737       9-Feb-2010

    ELECTRICAL HIGH TEMPERATURE TEST PROBE WITH CONDUCTIVE DRIVEN GUARD


  • US      No. 7,626,404       1-Dec-2009

    REPLACEABLE PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 7,545,157       9-Jun-2009

    SHIELDED PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER


  • CN      No. 03152461.3       22-Apr-2009

    SHIELDED PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 7,345,494       18-Mar-2008

    PROBE TILE FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 7,271,607       18-Sep-2007

    ELECTRICAL HIGH TEMPERATURE TEST PROBE WITH CONDUCTIVE DRIVEN GUARD


  • US      No. 7,259,577       21-Aug-2007

    SHIELDED PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 7,170,305       30-Jan-2007

    APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER


  • US      No. 7,148,710       12-Dec-2006

    PROBE TILE FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 6,992,495       31-Jan-2006

    SHIELDED PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER


  • US      No. 6,975,128       13-Dec-2005

    ELECTRICAL HIGH TEMPERATURE TEST PROBE WITH CONDUCTIVE DRIVEN GUARD


  • US      No. 6,963,207       8-Nov-2005

    APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER


  • US      No. 6,882,168       19-Apr-2005

    PROBE TILE FOR PROBING SEMICONDUCTOR WAFER


  • TW      No. I226096       1-Jan-2005

    PROBE PLATFORM AND METHOD FOR ELECTRICALLY PROBING SEMICONDUCTOR WAFERS


  • TW      No. 204761       11-Jun-2004

    APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER