200mm & 300mm VersaPlate™

With a 200mm or 300mm VersaPlate™ with VersAdjust™, you can perform wafer level reliability tests at high temperatures, many sites, low currents and for long test times. Collect more data faster, using the same probes for single site and multi-site measurements. Adjust to die pitch changes without having to throw your probe cards away.

• Allows for die to die spacing adjustments for new layouts, new temperature ranges, wafer expansion, smaller pad size, out of tolerance probe alignment, warped chucks
• Can be used to test at high temperature, many sites, low current test and for long test times
• Each VersaPlate™ is designed for your application. 
• A VersaPlate™ can have up to 9 tiles on 200mm Celadon Modular Adapter and up to 17 tiles on a 300mm Celadon Modular Adapter
• Product requires probe station with either upward looking microscope or microscope with suitable x-y travel to view sites being probed for alignment process