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Have you ever needed to make slight changes for die to die spacing changes for:
- New Layout
- New Temperature Range
- New Temperature Ranges
- The Wafer expands slightly more in one direction than the other due to:
- Grain
- Metalization Pattern?
- Smaller Pad Sizes?
- Out of Tolerance Probe Alignment or probes that have gone out of alignment?
- Warped Chucks
VersaAdjust can help with these problems!
- Allows for Die to Die Spacing Adjustments
- Adjustments are done live using either a lookup camera or downward looking camera
Spacing Adjustment Ranges are as follows:
| X |
"+/- 500 microns |
| Y |
"+/- 500 microns |
| Z |
"+/- 200 microns |
| Theta |
"+/- 5 degrees |
Why is it needed:
- 300 mm Wafers Expand from Center to edge up to 150 Microns for 300 degree range
- Wafer Pad Sizes are going down to 40 microns
- Small Probes go out of alignment faster
- Testing Temperature Ranges become more specific with small pads so you re-adjust outer die first as temperature
- The VersaPlate™ is made from a temperature compensated metal in
which the maximum expansion difference is 80 as measured between wafer
and probes in a VersaPlate™
- Eliminates the need for multiple probe cards for some applications
- Reduces the need for factory alignments for die to die spacing changes
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VersaPlate™ holder for two
VersaTiles™ with VersAdjust™
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