Wafer Level Reliability

Reliability in either Single Site or Multi-Site.

High density, multi-site, high temperature wafer level reliability testing is possible in a variety of formats with probe cards and probing solutions from Celadon.

Several applications include oxide reliability, transistor reliability and interconnect reliability. Traditional packaged part reliability is not possible for many advanced process technologies, is becoming increasingly costly and adds huge delays to process development cycles.

For adjustable wafer level reliability testing, explore the  TV19 VersaTile™ Probe Card and VersAdjust™ plates. Learn more…

 

T90 Series Probe Cards make high density wafer level reliability testing possible in a standard 4.5″ probe card profile. Learn more…

 

T200 and T300 ButtonTile™ Probe Cards can probe an entire wafer, high density, and at high temperature. Learn more…

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