1x3 VersaPlate™

With a 1x3 VersaPlate™ with VersAdjust™, you can perform wafer level reliability tests at high temperature, many sites, low current and for long test times. Collect more data faster, using the same probes for single site and multi-site measurements. Adjust to die pitch changes without having to throw your probe cards away.

• The 1 x 3 VersaPlate™ is designed to be extremely versatile for different die pattern spacings (30mm to 55mm)
• Allows for die to die spacing adjustments for new layouts, new temperature ranges, wafer expansion, smaller pad size, out of tolerance probe alignment, warped chucks
• Can be used to test at high temperature, many sites, low current test and for long test times
• The 1 x 3 VersaPlate™ accommodates up to 3 VersaTiles™
• Product requires probe station with either upward looking microscope or microscope with suitable x-y travel to view sites being probed for alignment process

1x3 VersaPlate™ Demonstration