Celadon Systems, Inc.

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Wafer Probing Product Feature Comparsion Matrix

  PCB Mounted Ceramic Single Site Ceramic AttoFastTM Single Site Ceramic Small Multi-Site 72mm Ceramic 200mm Multi-Site (full wafer) 300mm Multi-Site (full wafer) VersaTileTM TVLC
 VersaTileTM TVLL VersaTileTM TVHT
 
Operating Temperature Range
5°C to 85°C X X X X X X X X X
5°C to 200°C X X X X X X   X X
-65°C to 300°C   X X X X X   X X
5°C to 300°C   X X X X   X X  
Expansion Matched   X X X X X   X X
Electrical Characteristics
Ultra low leakage (<1 Fempto Amps/Volt) and fast settling time (<1 second)   X X X X X   X X
Low leakage (<5 Fempto Amps/Volt) and medium settling time (<5 seconds) X X X X X X X X X
High Current, High Voltage Option X X X X X X   X X
Probe Station Mount
Fits Std. RF Positioner with Planarization             X X X
Fits Std. 4.5 Inch Probe Card Holder X X X X     X X X
Uses Celadon Modular AdapterTM to mount probe card X X X X X X X X X
Fits Std. 4.5 Inch Probe Card Holder with Single Site VersaPlateTM             X X X
Unique Features
Single-site X X X X X X X X X
Multi-site X     X X X      
Rigid Ceramic Construction X X X X X X X X X
Rigid Metal Chassis X X X X X X X X  
Low Cost of Ownership X X X X X X X X X
Supports Ultra Fast Probing on Low Current Devices     X            
Crash Resistant Probes in Recessed Ceramic Cavity Available X X X X X X X X X
Autoprober Light Tight Shielded Environmental Enclosure   X X X X X   X X
Applications
Production and Functional Test X         X X X  
Multi-Site Production or Parallel Test X                
Process Development and Device Characterization   X X X X X   X X
High Accuracy Process Development and Device Characterization   X X           X
Transistor hot carrier injection (HCI)   X X X X X   X X
Eletromigration (EM)       X X X   X X
Transistor negative bias temperature instability (NBTI)   X X X X X   X X
Time dependent dielectric breakdown (TDDB)   X X X X X   X X
Wafer level burn-in       X X X   X X
Wafer level life test       X X X   X X