About Celadon Systems

Engineering the Technologies Behind Tomorrow’s Semiconductor Breakthroughs

At Celadon Systems, we believe the world’s most advanced semiconductor technologies are created through collaboration.

We partner with semiconductor innovators to engineer and manufacture customized wafer probing solutions for the industry’s most demanding applications. From silicon photonics and quantum computing to focal plane arrays (FPAs), high-power devices, wafer-level reliability, extreme-environment testing, and advanced characterization, we help our customers solve complex engineering challenges, advance breakthrough research, and accelerate the commercialization of emerging technologies.

Our greatest innovations don’t happen in isolation – they happen through trusted, long-term partnerships with our customers. By combining engineering expertise, manufacturing excellence, and collaborative problem-solving, we develop customized solutions that advance breakthrough research and help transform innovative ideas into production-ready technologies.

Engineering Expertise. Manufacturing Excellence. Trusted Partnerships.

What makes Celadon different isn’t simply what we build: it’s how we work.

Our engineers become an extension of our customers’ engineering teams, collaborating closely from concept through production. This customer-first approach enables us to solve challenges that others often consider too difficult, developing innovative solutions for emerging technologies and applications where precision, performance, and reliability are critical.

Celadon also partners with advanced research groups, specialized laboratories, and universities to develop first-of-their-kind probing solutions for extreme test environments and emerging applications. While some of this work may never move into production, the technical knowledge gained through these collaborations continually expands our engineering expertise and strengthens the solutions we develop across our broader portfolio.

Unlike companies that only design or only manufacture, Celadon brings both capabilities together under one roof. Our world-class U.S. manufacturing facility transforms innovative engineering concepts into production-ready solutions with exceptional quality, consistency, and responsiveness. By integrating engineering and manufacturing, we help customers reduce development risk, shorten design cycles, improve test efficiency, and bring new technologies to market faster.

Our Story

Founded in 1997 by Bryan and Valerie Root and headquartered in Burnsville, Minnesota, Celadon Systems was built on a simple idea: engineering excellence and customer partnerships create better solutions.

What began as a small, customer-focused engineering company has grown into a trusted global partner serving the world’s leading semiconductor companies. While semiconductor technology has advanced dramatically over the past three decades, our commitment has remained unchanged: to solve our customers’ toughest challenges through technical expertise, innovation, and collaboration.

In 2021, Celadon Systems became part of MPI Corporation, a global leader in semiconductor test headquartered in Hsinchu, Taiwan. The combination brings together Celadon’s advanced probing and measurement expertise with MPI’s global reach and complementary semiconductor test technologies. This cross-pollination of talent and technology has accelerated joint development and enabled us to deliver more complete solutions to customers worldwide.

Today, Celadon continues to push the boundaries of wafer probing technology while remaining true to the principles on which the company was founded: integrity, innovation, agility, collaboration, dedication to excellence, and an unwavering commitment to our customers’ success.

Why Customers Choose Celadon

  • Engineering Agility

    We move quickly, adapting designs and developing customized solutions to meet evolving technical requirements and compressed development schedules.

  • Collaborative Partnership

    We believe the best engineering solutions are created together. Our long-term customer relationships foster trust, shared learning, and continuous innovation.

  • Manufacturing Excellence

    Our U.S.-based manufacturing team delivers precision-built, production-ready solutions with exceptional quality and repeatability.

  • Complex Problem Solving

    We specialize in applications where standard solutions aren’t enough, partnering with customers to overcome the industry’s most demanding wafer probing challenges, including extreme test environments and emerging applications with no established solution.

  • Focused Innovation

    From groundbreaking research and novel applications to full-scale production, every solution we develop expands what is possible in semiconductor testing, and the expertise gained from each challenge strengthens the work that follows.

Our Purpose

At Celadon, we are more than a probe card manufacturer.

We are an engineering and manufacturing partner dedicated to helping our customers bring the next generation of semiconductor technologies to life.

Our vision is to expand what is possible in wafer testing by combining technical expertise, focused innovation, and trusted collaboration from frontier research to demanding production applications.

Together, we solve complex challenges, accelerate innovation, and move the semiconductor industry forward.

Together, we’re Engineering the Future of Semiconductors.

Our History

A Legacy of Innovation

Since 1997, Celadon Systems has partnered with semiconductor innovators to solve complex wafer probing challenges and expand what is possible in semiconductor testing. From pioneering ceramic probe card technologies to advancing extreme-temperature, cryogenic, high-voltage, silicon photonics, and ultra-low-leakage applications, our history is defined by engineering expertise, collaborative problem-solving, and a commitment to turning demanding test requirements into innovative, reliable solutions.

1997 — Celadon Systems Is Founded

Bryan and Valerie Root establish Celadon Systems in Minnesota.
The company develops its first adjustable, multisite ceramic probe card on a 3 × 3 platform.

1998 — Advanced Cantilever™ Technology

Celadon invents and introduces Advanced Cantilever™ technology, along with the first low-leakage and multisite ceramic probe cards capable of operating from –65°C to 300°C.

2000 — T200 ButtonTile™

Celadon introduces the T200 ButtonTile™, a 200 mm ceramic probe card featuring Advanced Cantilever™ technology, and moves from its original basement location into its first dedicated facility.

2002 — AttoFast™

Celadon introduces AttoFast™, the first coaxial probe capable of operating at temperatures up to 300°C.

2003–2007 — Expanding the Product Portfolio

Celadon introduces several innovative ceramic probing platforms, including the T300 ButtonTile™, MiniTile™, VersaTile™, VersAdjust™, and the T90™ multisite probe card.

2005 — Extreme-Temperature Testing

Celadon develops the first ceramic probe card capable of operating at temperatures up to 500°C, extending the boundaries of extreme-environment wafer testing.

2009 — VersaCore™

Celadon introduces the VersaCore™, the first easy-insertion, twist-lock probe card core, creating the foundation for a new generation of modular probing solutions.

2011 — Advancing Wafer-Level Reliability

Celadon receives a government research grant to advance high-density, multisite wafer-level reliability testing.

2012 — VC20 VersaCore™

Celadon introduces the VC20 VersaCore™, enabling fast probe card changes for parametric testing, device modeling and characterization, and wafer-level reliability applications.

2013 — The Indexer™

Celadon introduces the Indexer™, the industry’s first automatic probe card changer, designed to improve tester utilization, automate probe card exchanges, and support system diagnostics.

2014 — Customer Focus Teams

Celadon establishes its first production-focused Customer Focus Team, formalizing a collaborative partnership that brings customer and Celadon teams together to solve complex testing challenges, improve test efficiency, and support long-term production success.

2015 — Expanded Capabilities and Collaboration

Celadon relocates to an expanded Minnesota facility with larger engineering laboratories, cleanroom space, and manufacturing capacity. The company also advances high-voltage, high-current, and cabled-out VC20™ solutions while collaborating with customers and industry partners on significant technical publications.

2017 — A Production Milestone

A leading semiconductor company surpasses 20 million production touchdowns using Celadon VC20™ probe cards, demonstrating the platform’s durability and performance in high-volume manufacturing.

2018 — VersaJet™ and Integrated Test Solutions

Celadon launches the VersaJet™ system and integrates its MiniTile™ technology into a silicon photonics test system developed in collaboration with a leading test equipment company.

2019 — Cryogenic Innovation

Celadon invents and ships the first cryogenic MobilProbe™, an integrated carrier and probe card that enables probing without a conventional prober. Its growing cryogenic portfolio supports advanced defense and quantum-computing applications.

2020 — New Leadership and Continued Innovation

Karen Armendariz is named president and CEO. Celadon maintains full business continuity throughout the COVID-19 pandemic while continuing investments in engineering, manufacturing, and advanced cryogenic technology.
That same year, founder Bryan Root is elevated to IEEE Fellow in recognition of his contributions to the semiconductor industry.

2021 — Growth, Quality, and a Global Partnership

Celadon hosts its first virtual Core Users Group, featuring six customer papers and more than 100 attendees. The company also earns ISO 9001 certification while achieving record annual revenue.

Later that year, Celadon is acquired by MPI America, a wholly owned subsidiary of MPI Corporation. The combination brings together Celadon’s probing and measurement expertise with MPI’s global reach and complementary semiconductor test technologies while maintaining Celadon’s team and operations in Minnesota.

2022 — Expanding Capabilities and Industry Leadership

Celadon qualifies an advanced silicon photonics solution with a leading tester company for a strategic customer application while making significant capital investments in state-of-the-art test and inspection equipment, expanding its engineering, validation, and manufacturing capabilities.

Celadon also plays an instrumental role in establishing the SWTCrew Committee and continues to lead the organization today. With the support of SWTest, this industry initiative has meaningfully increased the participation, visibility, and professional development of women throughout the probe card community.

2023 — Recognizing and Advancing Innovation

Celadon establishes the annual Bryan Root and Bill Funk Innovation Award. The company also collaborates with a leading tester company to develop the first modular, production high-power probe card solution capable of operating at 200°C and 3 kV.

2024 — Investing in the Future

Celadon makes significant investments in advanced test and inspection equipment and AI-enabled business systems, strengthening its engineering, manufacturing, and quality capabilities. The company also launches the New Tiger development program with MPI to advance vertical VC20™ technology.

2025 — Peregrine™ and a Global Users Group Community

Celadon introduces Peregrine™, the fastest settling and lowest-leakage member of the VC20™ probe card family, and secures a Tier 1 high-bandwidth memory (HBM) parametric fab production application.
The company also hosts its first in-person Core Users Group in Taiwan, bringing together more than 150 attendees and featuring 16 papers from customers and industry partners.

2026 — Building the Next Chapter

Celadon continues to invest in advanced manufacturing and inspection technologies while sharpening its strategic focus on differentiated production and specialty applications.

In 2026, Celadon introduces its Cryo RF product to the market, expanding its capabilities to support advanced testing in cryogenic environments. This milestone reflects Celadon’s continued commitment to developing innovative solutions for complex and emerging wafer probing applications.

As Celadon looks ahead to its 30th anniversary in 2027, we are excited to build on three decades of innovation and begin the next chapter of our journey.